ECORELTM and ECOFRECTM soldering materials are utilized in processes such as ball attach (CSP, BGA), flip chip, and wafer bumping, which are used in the manufacturing of power semiconductors, flash memories, micro-modules and hybrid assemblies.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Die attach

 

ECORELTM solder pastes exhibit good wettability on Ni, NiP, Cu and Pb finished surfaces with a low percentage of voids and excellent flux residue. cleanability.

 

 

 

 

 

 

 

 

 

 

Defluxing

 

We offer cleaning solutions for use after die attach in power semiconductor applications, especially when packaging is done using solder paste.

 

For hybrid packaging, our cleaning solutions can integrate water and solvent based chemistries to efficiently removed organic and inorganic residues that remain on the substrate.

 

INVENTEC has decades of experience in chemicals used for cleaning the core of power electronics systemsto the most stringent reliability, performance, cost, and environmental requirements.

 

Our product offering also includes specialized cleaning solutions uses during each cleaning step required during the assembly of IGBT power modules.